A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.