Invention Grant
- Patent Title: Slicing architecture for wireless communication
-
Application No.: US15670923Application Date: 2017-08-07
-
Publication No.: US10057777B2Publication Date: 2018-08-21
- Inventor: Qian Li , Huaning Niu , Geng Wu , Mo-Han Fong , Apostolos Papathanassiou
- Applicant: Intel IP Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL IP CORPORATION
- Current Assignee: INTEL IP CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H04W16/02
- IPC: H04W16/02 ; H04W88/08 ; H04W24/02 ; H04W28/08
Abstract:
Embodiments provide a system, apparatus, or non-transitory computer readable medium to provide a slicing architecture for wireless communications systems.
Public/Granted literature
- US20170339567A1 SLICING ARCHITECTURE FOR WIRELESS COMMUNICATION Public/Granted day:2017-11-23
Information query
