Invention Grant
- Patent Title: Memory device and method of manufacturing the same
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Application No.: US15362906Application Date: 2016-11-29
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Publication No.: US10062841B2Publication Date: 2018-08-28
- Inventor: Il-mok Park , Gwan-hyeob Koh , Dae-hwan Kang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2016-0021318 20160223
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A memory device including first conductive lines spaced apart from each other and extending in a first direction; second conductive lines spaced apart from each other and extending in a second direction that is different from the first direction; first memory cells having a structure that includes a selection device layer, a middle electrode layer, a variable resistance layer, and a top electrode layer; and insulating structures arranged alternately with the first memory cells in the second direction under the second conductive lines, wherein the first insulating structures have a top surface that is higher than a top surface of the first top electrode layer, and the second conductive lines have a structure that includes convex and concave portions, the convex portions being connected to the top surface of the top electrode layer and the concave portions accommodating the insulating structures between the convex portions.
Public/Granted literature
- US20170244030A1 MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-08-24
Information query
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