Invention Grant
- Patent Title: Method for forming insulating layer covering a wiring pattern
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Application No.: US15363421Application Date: 2016-11-29
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Publication No.: US10064293B2Publication Date: 2018-08-28
- Inventor: Yutaro Kogawa , Mitsunori Sato , Yutaka Takezawa , Akitoshi Sakaue , Mitsutoshi Naito
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-234443 20151201
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H05K3/46 ; G06F3/044 ; H05K1/09 ; H05K1/11 ; H05K3/12

Abstract:
By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline.
Public/Granted literature
- US20170156218A1 METHOD FOR FORMING INSULATING LAYER, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE Public/Granted day:2017-06-01
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