- Patent Title: System and method for additive manufacturing of thermoset polymers
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Application No.: US15069440Application Date: 2016-03-14
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Publication No.: US10067499B2Publication Date: 2018-09-04
- Inventor: Hemant Bheda , Riley Reese
- Applicant: Arevo, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Arevo, Inc.
- Current Assignee: Arevo, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: McGeary Cukor LLC
- Agent Wayne S. Breyer; Robert P. Marley
- Main IPC: G05B19/4099
- IPC: G05B19/4099 ; B33Y10/00 ; B29C64/106
Abstract:
A system and method for additive manufacturing of otherwise thermosetting polymers, such as PAI, is disclosed. The system includes fast-curing hardware that facilitates curing each deposited layer before a successive layer is deposited. This reduces the time to provide a finished part from weeks to hours.
Public/Granted literature
- US20160266573A1 SYSTEM AND METHOD FOR ADDITIVE MANUFACTURING OF THERMOSET POLYMERS Public/Granted day:2016-09-15
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