Invention Grant
- Patent Title: Electronic device housing and assembly method
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Application No.: US14635440Application Date: 2015-03-02
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Publication No.: US10067537B2Publication Date: 2018-09-04
- Inventor: Yoshimichi Matsuoka , Michael James Louris , Jeffrey Hayashida , Jack Wanderman
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; B29C45/44

Abstract:
An electronic device includes a first housing of a single piece of material that has first and second spaced apart major walls that extend in lateral directions and at least three side walls extending perpendicular to the lateral directions between the major walls. The major walls and the side walls define an internal cavity, and the first housing defines an opening to the internal cavity opposite one of the side walls. At least one support member is within the internal cavity of the first housing adjacent a major walls a side wall thereof. At least one electronic component is contained within the internal cavity, and a first cover is removably affixed over the opening. At least one of the support member and the first cover contributes to a retention force applied on the at least one electronic component within the internal cavity of the first housing.
Public/Granted literature
- US20150169007A1 ELECTRONIC DEVICE HOUSING AND ASSEMBLY METHOD Public/Granted day:2015-06-18
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