Invention Grant
- Patent Title: Defect prediction method and apparatus
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Application No.: US14587724Application Date: 2014-12-31
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Publication No.: US10068176B2Publication Date: 2018-09-04
- Inventor: Wun Wah Edmond Chan , Lujia Pan
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN2013-1-0066324 20130228
- Main IPC: G06F15/18
- IPC: G06F15/18 ; G06N5/04 ; G06N99/00 ; G06F17/30

Abstract:
Embodiments of the present invention disclose a defect prediction method and apparatus, which relate to the data processing field, and implement accurate and quick locating of a defect in a faulty product. A specific solution is as follows: selecting a training attribute set from a pre-stored product fault record according to a target attribute, and combining the target attribute and the training attribute set into a training set, where the target attribute is a defect attribute of a historical faulty product; generating a classifier set according to the training set, where the classifier set includes at least two tree classifiers; and predicting a defect of a faulty product by using the classifier set as a prediction model. The present invention is used in a process of predicting a defect of a faulty product.
Public/Granted literature
- US20150112903A1 DEFECT PREDICTION METHOD AND APPARATUS Public/Granted day:2015-04-23
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