Invention Grant
- Patent Title: Semiconductor package, method of manufacturing the same, and electronic device module
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Application No.: US15598497Application Date: 2017-05-18
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Publication No.: US10068855B2Publication Date: 2018-09-04
- Inventor: Tae Hyun Kim , Thomas A. Kim , Kyu Bum Han , Kwan Hoo Son
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2016-0117253 20160912; KR10-2017-0025308 20170227
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L25/065
Abstract:
A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.
Public/Granted literature
- US20180076147A1 SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE MODULE Public/Granted day:2018-03-15
Information query
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