Invention Grant
- Patent Title: Nanowires for pillar interconnects
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Application No.: US15453113Application Date: 2017-03-08
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Publication No.: US10068864B2Publication Date: 2018-09-04
- Inventor: Charles L. Arvin , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Erik K. Johnson
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/56 ; H01L25/065 ; H01L25/00
Abstract:
An embodiment of the invention may include a semiconductor structure, and method of forming the semiconductor structure. The semiconductor structure may include a first set of pillars located on a first substrate. The semiconductor structure may include a second set of pillars located on a second substrate. The semiconductor structure may include a joining layer connecting the first pillar to the second pillar. The semiconductor structure may include an underfill layer located between the first and second substrate.
Public/Granted literature
- US20170179061A1 NANOWIRES FOR PILLAR INTERCONNECTS Public/Granted day:2017-06-22
Information query
IPC分类:
