Invention Grant
- Patent Title: Contacting SOI subsrates
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Application No.: US15375890Application Date: 2016-12-12
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Publication No.: US10068918B2Publication Date: 2018-09-04
- Inventor: Christian Haufe , Ingolf Lorenz , Michael Zier , Ulrich Gerhard Hensel , Navneet Jain
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/49 ; H01L21/84 ; H01L29/06

Abstract:
An integrated circuit is provided including a semiconductor bulk substrate, a buried oxide layer formed on the semiconductor bulk substrate, a plurality of cells, each cell having a transistor device, formed over the buried oxide layer, a plurality of gate electrode lines running through the cells and providing gate electrodes for the transistor devices of the cells, and a plurality of tap cells configured for electrically contacting the semiconductor bulk substrate and arranged at positions different from positions below or above the plurality of cells having the transistor devices.
Public/Granted literature
- US20170104005A1 CONTACTING SOI SUBSTRATES Public/Granted day:2017-04-13
Information query
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