Invention Grant
- Patent Title: Semiconductor device including fin FET and manufacturing method thereof
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Application No.: US15590301Application Date: 2017-05-09
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Publication No.: US10068992B2Publication Date: 2018-09-04
- Inventor: Hung Lo , Tzu-Hsiang Hsu , Chia-Jung Hsu , Feng-Cheng Yang , Teng-Chun Tsai , Ying-Ho Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L29/66 ; H01L21/762 ; H01L21/8238

Abstract:
A semiconductor device includes a fin structure for a fin field effect transistor (FET). The fin structure includes a base layer protruding from a substrate, an intermediate layer disposed over the base layer and an upper layer disposed over the intermediate layer. The fin structure further includes a first protective layer and a second protective layer made of a different material than the first protective layer. The intermediate layer includes a first semiconductor layer disposed over the base layer, the first protective layer covers at least side walls of the first semiconductor layer and the second protective layer covers at least side walls of the first protective layer.
Public/Granted literature
- US20170243957A1 SEMICONDUCTOR DEVICE INCLUDING FIN FET AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-08-24
Information query
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