Invention Grant
- Patent Title: Waterproof structure of pad, waterproof pad, and method for forming waterproof structure
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Application No.: US14058419Application Date: 2013-10-21
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Publication No.: US10069236B2Publication Date: 2018-09-04
- Inventor: Jun Wang , Junlin Zou , Xiaowei Zou
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Huawei Technologies Co., Ltd.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01R13/52 ; H01L23/00 ; H01R43/00

Abstract:
The present invention discloses a waterproof structure of a pad, a waterproof pad, and a method for forming the waterproof structure. The waterproof structure includes a first dielectric layer, having an annular hollowed-out recess along the periphery of the first dielectric layer and a metal annular zone formed in the annular hollowed-out recess, and a second dielectric layer, formed above the first dielectric layer and located under the pad and having multiple first through-holes along the periphery of the second dielectric layer and multiple metal posts formed in the multiple first through-holes, where the multiple first through-holes form a hollow annular through-hole chain and the metal annular zone maintains an electrical connection with the multiple metal posts.
Public/Granted literature
- US20140045372A1 Waterproof Structure of Pad, Waterproof Pad, and Method for Forming Waterproof Structure Public/Granted day:2014-02-13
Information query
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