Invention Grant
- Patent Title: Circuit board housing assembly
-
Application No.: US15368194Application Date: 2016-12-02
-
Publication No.: US10070548B2Publication Date: 2018-09-04
- Inventor: Yu Cheng Lin
- Applicant: MICROELECTRONICS TECHNOLOGY, INC.
- Applicant Address: TW Hsinchu
- Assignee: Microelectronics Technology, Inc.
- Current Assignee: Microelectronics Technology, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/14

Abstract:
A circuit board housing assembly includes a housing; a circuit board having an opening attached to the housing; and a board removal tool having a holding member, a rivet and a pin. The holding member has an aperture corresponding to the opening and the rivet is inserted in the opening and the aperture. The rivet has a head with a proximal end and a distal end and a central axis, the head has an internal passage extending parallel to the central axis from the proximal end to the distal end, and the distal end is mechanically connected to legs extending distally from the head and having an internal surface facing the central axis. When the pin is inserted into the internal passage along a direction from the proximal end towards the distal end, the pin applies force to the internal surface of the at least two legs in a direction perpendicular to the central axis.
Public/Granted literature
- US20180160560A1 CIRCUIT BOARD HOUSING ASSEMBLY Public/Granted day:2018-06-07
Information query