Invention Grant
- Patent Title: Glass ceramic sintered compact and wiring board
-
Application No.: US15574266Application Date: 2016-05-12
-
Publication No.: US10071932B2Publication Date: 2018-09-11
- Inventor: Hisashi Kobuke , Yousuke Futamata , Emi Ninomiya
- Applicant: SNAPTRACK, INC.
- Applicant Address: US CA San Diego
- Assignee: SnapTrack, Inc.
- Current Assignee: SnapTrack, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, L.L.P. Qualcomm
- Priority: JP2015-108744 20150528
- International Application: PCT/EP2016/060738 WO 20160512
- International Announcement: WO2016/188767 WO 20161201
- Main IPC: H05K1/00
- IPC: H05K1/00 ; C03C14/00 ; C03C10/00 ; H05K1/03

Abstract:
[Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.
Public/Granted literature
- US20180134613A1 GLASS CERAMIC SINTERED COMPACT AND WIRING BOARD Public/Granted day:2018-05-17
Information query