Invention Grant
- Patent Title: System-in-package and fabrication method thereof
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Application No.: US15182613Application Date: 2016-06-15
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Publication No.: US10074628B2Publication Date: 2018-09-11
- Inventor: Hsing-Chih Liu , Che-Ya Chou
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/065 ; H01L21/78 ; H01L25/00 ; H01L25/16 ; H01L23/31 ; H01L23/498 ; H01L23/00 ; H01L25/03 ; H01L25/18 ; H01L21/56

Abstract:
A system-in-package (SiP) includes a RDL structure having a first side and a second side opposite to the first side; a first semiconductor die mounted on the first side of the RDL structure, wherein the first semiconductor die has an active surface that is in direct contact with the RDL structure; a plurality of conductive fingers on the first side of the RDL structure around the first semiconductor die; a second semiconductor die stacked directly on the first semiconductor die, wherein the second semiconductor die is electrically connected to the plurality of conductive fingers through a plurality of bond wires; and a mold cap encapsulating the first semiconductor die, the conductive fingers, the second semiconductor die, and the first side of the RDL structure.
Public/Granted literature
- US20160293575A1 SYSTEM-IN-PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2016-10-06
Information query
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