Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
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Application No.: US14993212Application Date: 2016-01-12
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Publication No.: US10074717B2Publication Date: 2018-09-11
- Inventor: Jung-Han Lee , Jae-Hwan Lee , Sang-Su Kim , Hwan-Wook Choi , Tae-Jong Lee , Seung-Mo Ha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0052408 20150414
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/06 ; H01L27/088 ; H01L21/8234

Abstract:
A semiconductor device includes a plurality of active fins defined by an isolation layer on a substrate, a gate structure on the active fins and the isolation layer, and a gate spacer structure covering a sidewall of the gate structure. A sidewall of the gate structure includes first, second, and third regions having first, second, and third slopes, respectively. The second slope increases from a bottom toward a top of the second region. The second slope has a value at the bottom of the second region less than the first slope. The third slope is greater than the second slope.
Public/Granted literature
- US20160307927A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2016-10-20
Information query
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