Invention Grant
- Patent Title: Interconnect cable with edge finger connector
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Application No.: US14822693Application Date: 2015-08-10
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Publication No.: US10074920B2Publication Date: 2018-09-11
- Inventor: Donald T. Tran , Rajasekaran Swaminathan
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/72 ; H01R43/20 ; H01R13/6581 ; H01R12/71 ; H01R12/81 ; H01R13/6592

Abstract:
Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.
Public/Granted literature
- US20150357736A1 INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR Public/Granted day:2015-12-10
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