- 专利标题: Air conditioner and evaporator inlet header distributor therefor
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申请号: US15150804申请日: 2016-05-10
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公开(公告)号: US10077926B2公开(公告)日: 2018-09-18
- 发明人: Hongseong Kim , Sangyeul Lee , Inbeom Cheon , Hanchoon Lee , Juhyok Kim
- 申请人: LG ELECTRONICS INC.
- 申请人地址: KR Seoul
- 专利权人: LG ELECTRONICS INC.
- 当前专利权人: LG ELECTRONICS INC.
- 当前专利权人地址: KR Seoul
- 代理机构: KED & Associates LLP
- 优先权: KR10-2012-0123703 20121102; KR10-2012-0123704 20121102; KR10-2012-0123705 20121102
- 主分类号: F25B41/06
- IPC分类号: F25B41/06 ; F25B13/00 ; F25B39/02 ; F28F9/02 ; F28D21/00
摘要:
An air conditioner and evaporator inlet header distributor therefor are provided. The air conditioner may include an evaporator inlet header distributor to distribute a refrigerant expanded in an expansion mechanism to a plurality of refrigerant flow paths of an evaporator. The evaporator inlet header distributor may include a distributor body, a refrigerant inlet pipe to guide refrigerant expanded in the expansion mechanism to an inside of the distributor body, a plurality of refrigerant outlet pipes to discharge the refrigerant from the distributor body into the plurality of refrigerant flow paths, and a separating plate to separate the inside of the distributor body into a header flow path connected with the plurality of refrigerant outlet pipes and a refrigerant dispersing flow path connected with the refrigerant inlet pipe to guide an upper portion and a lower portion of the header flow path by dispersing the refrigerant. Accordingly, two-phase refrigerant may be uniformly distributed to the plurality of refrigerant outlet pipes using a simple structure.
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