Invention Grant
- Patent Title: Method and arrangement for handling and processing substrates
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Application No.: US15250977Application Date: 2016-08-30
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Publication No.: US10078274B2Publication Date: 2018-09-18
- Inventor: Hendrik Jan De Jong , Marco Jan-Jaco Wieland
- Applicant: Mapper Lithography IP B.V.
- Applicant Address: NL Delft
- Assignee: MAPPER LITHOGRAPHY IP B.V.
- Current Assignee: MAPPER LITHOGRAPHY IP B.V.
- Current Assignee Address: NL Delft
- Agency: Hoyng Rokh Monegier LLP
- Agent David P. Owen
- Priority: GB0905786.0 20090403
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/683 ; H01L21/687

Abstract:
The invention relates to a substrate handling and exposure arrangement comprising a plurality of lithography apparatus, a clamp preparation unit for clamping a wafer on a wafer support structure, a wafer track, wherein the clamp preparation unit is configured for accepting a wafer from the wafer track, and an additional wafer track for transferring the clamp towards the plurality of lithography apparatus.
Public/Granted literature
- US20160370704A1 METHOD AND ARRANGEMENT FOR HANDLING AND PROCESSING SUBSTRATES Public/Granted day:2016-12-22
Information query
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