Invention Grant
- Patent Title: Semiconductor chip package assembly with improved heat dissipation performance
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Application No.: US15064545Application Date: 2016-03-08
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Publication No.: US10079192B2Publication Date: 2018-09-18
- Inventor: Ching-Wen Hsiao , Tzu-Hung Lin , I-Hsuan Peng , Tung-Hsien Hsieh , Sheng-Ming Chang
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/50 ; H01L23/538 ; H01L23/00 ; H01L25/10 ; H01L25/16 ; H01L23/31 ; H01L23/498 ; H01L25/065

Abstract:
A semiconductor chip package assembly includes a package substrate having a chip mounting surface; a plurality of solder pads disposed on the chip mounting surface; a first dummy pad and a second dummy pad spaced apart from the first dummy pad disposed on the chip mounting surface; a solder mask on the chip mounting surface and partially covering the solder pads, the first dummy pad, and the second dummy pad; a chip package mounted on the chip mounting surface and electrically connected to the package substrate through a plurality of solder balls on respective said solder pads; a discrete device having a first terminal and a second terminal disposed between the chip package and the package substrate; a first solder connecting the first terminal with the first dummy pad and the chip package; and a second solder connecting the second terminal with the second dummy pad and the chip package.
Public/Granted literature
- US20160329262A1 SEMICONDUCTOR CHIP PACKAGE ASSEMBLY WITH IMPROVED HEAT DISSIPATION PERFORMANCE Public/Granted day:2016-11-10
Information query
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