Invention Grant
- Patent Title: Molded die slivers with exposed front and back surfaces
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Application No.: US15646163Application Date: 2017-07-11
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Publication No.: US10081186B2Publication Date: 2018-09-25
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; B41J2/045
Abstract:
In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
Public/Granted literature
- US20170305158A1 MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES Public/Granted day:2017-10-26
Information query
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