Invention Grant
- Patent Title: Semiconductor structure and method for reviewing defects
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Application No.: US15396805Application Date: 2017-01-02
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Publication No.: US10082471B2Publication Date: 2018-09-25
- Inventor: Yung-Teng Tsai , Hung-Chin Lin , Chia-Chen Sun , Chih-Yu Wu , Jun-Ming Chen , Chung-Chih Hung , Sheng-Chieh Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: B81B3/00
- IPC: B81B3/00 ; G01N21/93 ; H01L21/66 ; H01L23/544 ; G01N21/95
Abstract:
A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.
Public/Granted literature
- US20180188185A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR REVIEWING DEFECTS Public/Granted day:2018-07-05
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