Invention Grant
- Patent Title: Interconnection lines having variable widths and partially self-aligned continuity cuts
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Application No.: US15800551Application Date: 2017-11-01
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Publication No.: US10083858B2Publication Date: 2018-09-25
- Inventor: Nicholas Vincent Licausi , Guillaume Bouche
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Stephen Scuderi
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/768 ; H01L23/528 ; H01L23/522

Abstract:
A semiconductor cell includes a dielectric layer. An array of parallel metal lines is disposed in a longitudinal direction within the dielectric layer. The metal lines having line widths that are substantially equal to or greater than a predetermined minimum line width. Line spacers are disposed between the metal lines. The line spacers having line spacer widths that are substantially equal to or greater than a predetermined minimum line spacer width. The array of metal lines includes a signal line having a continuity cut disposed across its entire line width and a power line adjacent the signal line. The power line has a line width that is greater than twice the minimum line width. The power line has a notch disposed partially across its line width. The notch is aligned with the continuity cut in a direction perpendicular to the longitudinal direction of the metal lines.
Public/Granted literature
- US20180174896A1 INTERCONNECTION LINES HAVING VARIABLE WIDTHS AND PARTIALLY SELF-ALIGNED CONTINUITY CUTS Public/Granted day:2018-06-21
Information query
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