- 专利标题: Distribution and stabilization of fluid flow for interlayer chip cooling
-
申请号: US15798534申请日: 2017-10-31
-
公开(公告)号: US10083892B2公开(公告)日: 2018-09-25
- 发明人: Timothy J. Chainer , Pritish R. Parida , Fanghao Yang
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 L. Jeffrey Kelly
- 主分类号: H01L23/34
- IPC分类号: H01L23/34 ; H01L23/473 ; H01L23/427 ; H01L23/02 ; H01L23/367 ; H01L21/48
摘要:
A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.
公开/授权文献
信息查询
IPC分类: