- 专利标题: Waterproof terminal structure and electronic device module
-
申请号: US15801895申请日: 2017-11-02
-
公开(公告)号: US10084276B2公开(公告)日: 2018-09-25
- 发明人: Seiya Matsuo , Akihiro Matsunaga
- 申请人: Japan Aviation Electronics Industry, Limited
- 申请人地址: JP Tokyo
- 专利权人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 当前专利权人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 当前专利权人地址: JP Tokyo
- 代理机构: Muncy, Geissler, Olds & Lowe, P.C.
- 优先权: JP2017-014400 20170130
- 主分类号: H01R13/648
- IPC分类号: H01R13/648 ; H01R12/57 ; H01R33/965 ; H01R13/52 ; H01R13/11
摘要:
A waterproof terminal structure includes a contact having a spring contact point, and a terminal member that holds the contact, the terminal member including a contact connection portion having conductivity and connected to the contact, a seal portion tightly attached to an insulating waterproof member disposed at least along a circumference of an opening of a housing, and a substrate mount portion having conductivity and connected to a wiring portion of a substrate, the contact connection portion and the substrate mount portion being electrically connected to each other and positioned such that a water entering path from the contact connection portion toward the substrate mount portion is cut by the seal portion, the contact not penetrating the terminal member.
公开/授权文献
信息查询