- Patent Title: Molding system and method for directly gas-cooling a molding object
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Application No.: US14619643Application Date: 2015-02-11
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Publication No.: US10086547B2Publication Date: 2018-10-02
- Inventor: Shu-Chen Lin
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Taoyuan City
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Taoyuan City
- Agency: Rabin & Berdo, P.C.
- Priority: TW103135997A 20141017
- Main IPC: B29C45/73
- IPC: B29C45/73 ; B29C33/02 ; B29C33/04

Abstract:
A molding system for directly gas-cooling a molding object includes a cold air provider, two molding parts, a plurality of outlets, at least one air-providing molding part, at least one air passage, and a controller. The two molding parts are closed detachably to co-define a forming cavity therebetween. The outlets are arranged on the air-providing molding part. The air passage is connected to the cold air provider and the outlets. The controller drives the cold air provider to provide cold air to a molding object in the forming cavity directly when the two molding parts are separating.
Public/Granted literature
- US20160107357A1 MOLDING SYSTEM AND METHOD FOR DIRECTLY GAS-COOLING A MOLDING OBJECT Public/Granted day:2016-04-21
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