Invention Grant
- Patent Title: Chip resistor and method for manufacturing same
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Application No.: US15565704Application Date: 2016-04-07
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Publication No.: US10096409B2Publication Date: 2018-10-09
- Inventor: Kentaro Matsumoto
- Applicant: KOA Corporation
- Applicant Address: JP Ina-shi
- Assignee: KOA Corporation
- Current Assignee: KOA Corporation
- Current Assignee Address: JP Ina-shi
- Agency: Crowell & Moring LLP
- Priority: JP2015-083499 20150415
- International Application: PCT/JP2016/061439 WO 20160407
- International Announcement: WO2016/167182 WO 20161020
- Main IPC: H01C7/10
- IPC: H01C7/10 ; H01C17/00 ; H01C1/142 ; H01C17/12 ; H01C17/28

Abstract:
Provided is a chip resistor having wide and flat end-face electrodes on a surface thereof and having increased connection reliability between upper electrodes and the end-face electrodes. The chip resistor according to the present invention is provided with: a cuboidal insulating substrate 1; a pair of upper electrodes 2 disposed at both ends in a longitudinal direction on a surface of the insulating substrate 1; a resistor body 3 disposed between the upper electrodes 2; an insulating protective layer 4 covering the entire surfaces of the upper electrodes 2 and the resistor body 3; and a pair of end-face electrodes 5 disposed on both end faces in the longitudinal direction of the insulating substrate 1, wherein the upper electrodes 2 include bent portions 2a extending around from between the insulating substrate 1 and the protective layer 4 along the end faces of the protective layer 4, and the end-face electrodes 5 are connected to the exposed portions of the upper electrodes 2, including the bent portions 2a, exposed from between the insulating substrate 1 and the protective layer 4.
Public/Granted literature
- US20180075954A1 Chip Resistor and Method for Manufacturing Same Public/Granted day:2018-03-15
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