Invention Grant
- Patent Title: Method for fabricating electronic package
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Application No.: US15666005Application Date: 2017-08-01
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Publication No.: US10096541B2Publication Date: 2018-10-09
- Inventor: Ching-Wen Chiang , Hsin-Chih Wang , Chih-Yuan Shih , Shih-Ching Chen
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW104144636A 20151231
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L21/56 ; H01L21/306 ; H01L21/304 ; H01L21/48

Abstract:
A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
Public/Granted literature
- US20170330826A1 METHOD FOR FABRICATING ELECTRONIC PACKAGE Public/Granted day:2017-11-16
Information query
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