Invention Grant
- Patent Title: Multilayer substrate, component mounted board, and method for producing component mounted board
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Application No.: US15673451Application Date: 2017-08-10
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Publication No.: US10103092B2Publication Date: 2018-10-16
- Inventor: Kuniaki Yosui , Keisuke Ikeno , Yuki Ito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2015-220255 20151110
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H05K1/02 ; H05K3/32 ; H05K3/46 ; H01L21/48 ; H01L23/00 ; H01L23/14

Abstract:
A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly and being in a floating state. When the element assembly is viewed from a normal direction that is normal to the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and when the element assembly is viewed from the normal direction, an area within a circle with a center on the m-th external electrode and with a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am with a radius of Dm smaller than the average Dave when viewed from the normal direction.
Public/Granted literature
- US20170338172A1 MULTILAYER SUBSTRATE, COMPONENT MOUNTED BOARD, AND METHOD FOR PRODUCING COMPONENT MOUNTED BOARD Public/Granted day:2017-11-23
Information query
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