Invention Grant
- Patent Title: First EM-tunnel embedded in a first PCB and free space coupled to a second EM-tunnel embedded in a second PCB
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Application No.: US15043288Application Date: 2016-02-12
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Publication No.: US10103418B2Publication Date: 2018-10-16
- Inventor: Hyo Hoon Park , Hyeon Min Bae , Tae Woo Lee
- Applicant: Korea Advanced Institute of Science and Technology
- Applicant Address: KR Daejeon
- Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee Address: KR Daejeon
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2016-0006066 20160118
- Main IPC: H01P3/12
- IPC: H01P3/12 ; H01P5/107 ; H01P3/16 ; H01P5/02 ; H01P5/08 ; H01P11/00 ; H01P1/04 ; H05K1/02
Abstract:
Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.
Public/Granted literature
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