An electronic device including a universal serial bus type-C connector. The connector includes a first plurality of contacts and a second plurality of contacts. Each of the first plurality of contacts and each of the second plurality of contacts include a first layer formed of a first material and a second layer formed of a second material, the second layer over the first layer. The second layer is present in a first area of each of the first plurality of contacts and the second layer is absent from the first area of each of the second plurality of contacts.