- 专利标题: Resin substrate and electronic device
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申请号: US15652282申请日: 2017-07-18
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公开(公告)号: US10104766B2公开(公告)日: 2018-10-16
- 发明人: Kuniaki Yosui
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2015-127178 20150625
- 主分类号: H05K7/10
- IPC分类号: H05K7/10 ; H05K7/12 ; H05K1/02 ; H05K1/03 ; H05K1/11 ; H05K1/18 ; H05K3/00 ; H05K3/30 ; H05K3/40 ; H05K3/46 ; H05K3/02
摘要:
A resin substrate includes an insulating base material in which conductive particles are mixed with resin, and conductor patterns provided on the principal surfaces of the insulating base material. When a length at a position at which a distance between two conductor patterns that are adjacent to each other without directly electrically connecting to each other on the same principal surface of the insulating base material is smallest is indicated by L1 and a length at a position at which a distance between two conductor patterns that face each other without directly electrically connecting to each other between the different principal surfaces of insulating base materials is smallest is indicated by L2, L1 is larger than or equal to L2 (L1 ≥L2).
公开/授权文献
- US20170318668A1 RESIN SUBSTRATE AND ELECTRONIC DEVICE 公开/授权日:2017-11-02
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