Electronic device and metal housing thereof
摘要:
A metal housing is provided. The metal housing includes a bottom plate, a first side plate, a second side plate, a third side plate, a fourth side plate, and a ground portion. The second side plate is parallel to the first plate. The fourth side plate is parallel to the third side plate. The first side plate, the second side plate, the third side plate, and the fourth side plate are integrally formed on the bottom plate. The ground portion is formed on an inner surface of one of the side plates. The ground portion includes a restriction structure and an opening. The restriction structure is integrally formed on the inner surface. The restriction structure is adapted to hold a ground line.
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