Invention Grant
- Patent Title: Optical semiconductor element and laser device assembly
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Application No.: US15519443Application Date: 2015-08-20
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Publication No.: US10109980B2Publication Date: 2018-10-23
- Inventor: Rintaro Koda , Masaru Kuramoto , Shunsuke Kono , Hideki Watanabe , Hiroshi Yoshida
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2014-216202 20141023
- International Application: PCT/JP2015/073305 WO 20150820
- International Announcement: WO2016/063605 WO 20160428
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/10 ; H01S5/026 ; H01S5/042 ; H01S5/22 ; H01S5/343 ; H01S5/50 ; H01S5/062 ; H01S5/323 ; H01S5/20 ; H01S5/0625

Abstract:
Provided is an optical semiconductor element including: a stacked structure body 20 formed of a first compound semiconductor layer 21, a third compound semiconductor layer (active layer) 23, and a second compound semiconductor layer 22. A fundamental mode waveguide region 40 with a waveguide width W1, a free propagation region 50 with a width larger than W1, and a light emitting region 60 having a tapered shape (flared shape) with a width increasing toward a light emitting end surface 25 are arranged in sequence.
Public/Granted literature
- US20170250522A1 OPTICAL SEMICONDUCTOR ELEMENT AND LASER DEVICE ASSEMBLY Public/Granted day:2017-08-31
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