Invention Grant
- Patent Title: Electronic module
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Application No.: US14998114Application Date: 2015-12-24
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Publication No.: US10115712B2Publication Date: 2018-10-30
- Inventor: Shao-Chueh Hu , Yueh-Chiung Chang , Don-Son Jiang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW104126217A 20150812
- Main IPC: H01L25/11
- IPC: H01L25/11 ; H05K7/02 ; H01Q3/44

Abstract:
An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the insulating layer. The insulating layer is bonded to the encapsulant with the antenna structure being electrically connected to the electronic element. Since the second package having the antenna structure is stacked on the first package, the invention eliminates the need to increase the area of the first package for mounting the antenna structure and hence allows the electronic module to meet the miniaturization requirement.
Public/Granted literature
- US20170048981A1 Electronic Module Public/Granted day:2017-02-16
Information query
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