- 专利标题： Method of manufacturing a device substrate and a display device manufactured using the same
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申请号： US15485667申请日： 2017-04-12
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公开(公告)号： US10133099B2公开(公告)日： 2018-11-20
- 发明人: Hyunwoo Koo , Taewoong Kim , Sunho Kim , Danbi Choi
- 申请人： SAMSUNG DISPLAY CO., LTD.
- 申请人地址： KR Yongin, Gyeonggi-Do
- 专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人地址： KR Yongin, Gyeonggi-Do
- 代理机构： F. Chau & Associates, LLC
- 优先权： KR10-2014-0002950 20140109
- 主分类号： G02F1/1333
- IPC分类号： G02F1/1333 ; B29C70/88 ; B29L9/00 ; B29L31/34 ; B29K79/00 ; B29K83/00 ; G02F1/1339 ; G02F1/1341 ; G02F1/1343 ; G02F1/1362 ; G02F1/1368
摘要：
A device substrate manufacturing method includes forming a debonding layer on a carrier substrate. An inorganic adhesive layer is formed on at least a portion of the debonding layer. A process substrate is formed on the carrier substrate. A device is formed on the process substrate, and the process substrate is separated from the carrier substrate.
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