Invention Grant
- Patent Title: Semiconductor device having a flexible substrate and a crack-preventing semiconductor layer
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Application No.: US14976411Application Date: 2015-12-21
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Publication No.: US10134904B2Publication Date: 2018-11-20
- Inventor: Hiroki Adachi , Kayo Kumakura
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-081897 20130410
- Main IPC: H01L21/77
- IPC: H01L21/77 ; H01L21/84 ; H01L27/12 ; H01L29/786

Abstract:
Provided is a flexible device with fewer defects caused by a crack or a flexible device having high productivity. A semiconductor device including: a display portion over a flexible substrate, including a transistor and a display element; a semiconductor layer surrounding the display portion; and an insulating layer over the transistor and the semiconductor layer. When seen in a direction perpendicular to a surface of the flexible substrate, an end portion of the substrate is substantially aligned with an end portion of the semiconductor layer, and an end portion of the insulating layer is positioned over the semiconductor layer.
Public/Granted literature
- US20160111550A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-04-21
Information query
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