Invention Grant
- Patent Title: Electrical interconnect structure for an embedded electronics package
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Application No.: US15827199Application Date: 2017-11-30
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Publication No.: US10141203B2Publication Date: 2018-11-27
- Inventor: Paul Alan McConnelee , Arun Virupaksha Gowda
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Main IPC: H01L29/74
- IPC: H01L29/74 ; H01L31/111 ; H01L23/053 ; H01L23/12 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/56 ; H01L23/538 ; H01L23/00 ; H01L21/768 ; H01L23/498 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L25/16 ; H01L25/00 ; H01L23/14 ; H01L23/31 ; H01L25/10
Abstract:
An electronics package includes a lower insulating layer, an upper insulating layer coupled to the lower insulating layer, and a conductive contact pad coupled to a second surface of the upper insulating layer. An electrical component is positioned within an opening formed through the upper insulating layer. A first interconnect layer extends through at least one via in the lower insulating layer to electrically couple with at least one contact pad on the electrical component and a second interconnect layer extends through at least one via in the upper insulating layer and electrically couples the first interconnect layer to the conductive contact pad.
Public/Granted literature
- US20180082857A1 ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE Public/Granted day:2018-03-22
Information query
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