Invention Grant
- Patent Title: Methods and apparatus for transferring a substrate
-
Application No.: US14933628Application Date: 2015-11-05
-
Publication No.: US10153187B2Publication Date: 2018-12-11
- Inventor: Sriskantharajah Thirunavukarasu , Eng Sheng Peh , Srinivas D. Nemani , Arvind Sundarrajan , Avinash Avula , Ellie Y. Yieh
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/67

Abstract:
Embodiments method and apparatus for transferring a substrate are provided herein. In some embodiments, a substrate cassette includes a body having an upper portion and a lower portion, the upper portion and the lower portion defining an interior volume when the upper portion is coupled to the lower portion; a locking mechanism moveable between a locked position, in which the upper and lower portions are coupled, and an unlocked position, in which the lower portion can be separated from the upper portion; and a load distribution plate coupled to an upper surface of the upper portion along an edge of the upper portion to distribute a load applied to the load distribution plate.
Public/Granted literature
- US20160133490A1 METHODS AND APPARATUS FOR TRANSFERRING A SUBSTRATE Public/Granted day:2016-05-12
Information query
IPC分类: