Invention Grant
- Patent Title: Electronic device structures joined using shrinking and expanding attachment structures
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Application No.: US15162931Application Date: 2016-05-24
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Publication No.: US10162392B2Publication Date: 2018-12-25
- Inventor: Tyler S. Bushnell , Jason C. Sauers
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: H05K13/00
- IPC: H05K13/00 ; G06F1/18 ; H01R4/72 ; G06F1/16

Abstract:
An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.
Public/Granted literature
- US20160270272A1 Electronic Device Structures Joined Using Shrinking and Expanding Attachment Structures Public/Granted day:2016-09-15
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