Invention Grant
- Patent Title: Optical measurement of bump hieght
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Application No.: US15346607Application Date: 2016-11-08
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Publication No.: US10168524B2Publication Date: 2019-01-01
- Inventor: Ronny Soetarman , James Jianguo Xu
- Applicant: Zeta Instruments, Inc.
- Applicant Address: US CA Milpitas
- Assignee: KLA-TENCOR CORPORATION
- Current Assignee: KLA-TENCOR CORPORATION
- Current Assignee Address: US CA Milpitas
- Agency: Imperium Patent Works LLP
- Agent Mark D. Marrello
- Main IPC: G02B21/24
- IPC: G02B21/24 ; G02B21/36 ; G02B21/00 ; G02B21/26

Abstract:
A method of generating 3D information including: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps; capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across a first portion of pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on an apex of a bump of the sample; determining a second captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the apex of the bump and the first surface.
Public/Granted literature
- US20180045947A1 OPTICAL MEASUREMENT OF BUMP HIEGHT Public/Granted day:2018-02-15
Information query