Invention Grant
- Patent Title: Coil device capable of performing a wire connection
-
Application No.: US15003602Application Date: 2016-01-21
-
Publication No.: US10170234B2Publication Date: 2019-01-01
- Inventor: Hiroyuki Iwata , Nobuo Takagi , Hiroyuki Abe , Koji Shimura
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Arent Fox LLP
- Priority: JP2015-010314 20150122; JP2015-010324 20150122
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00 ; H01F17/04 ; H01F27/30

Abstract:
A coil device includes a magnetic core and terminal electrodes. The terminal electrodes include attachment pieces, wire connection rising pieces, connection pieces, and fillet forming pieces. The wire connection rising pieces are integrally risen from one ends in a longitudinal direction of the attachment pieces along a side surface in the X-axis direction of a flange. The connection pieces are integrally formed with upper end sides of the wire connection rising pieces and have welded balls connected to lead parts of a wire by laser welding. The fillet forming pieces are integrally risen from one ends in a lateral direction crossing the longitudinal direction of the attachment pieces along a side surface in the Y-axis direction of the flange. Laser shielding members are arranged between the welded balls and the flange of a magnetic core.
Public/Granted literature
- US20160217919A1 COIL DEVICE Public/Granted day:2016-07-28
Information query