Invention Grant
- Patent Title: Multilayer capacitor and installation structure of multilayer capacitor
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Application No.: US14813204Application Date: 2015-07-30
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Publication No.: US10170247B2Publication Date: 2019-01-01
- Inventor: Yohei Mukobata , Takashi Sawada , Kazuhiro Nishibayashi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-164922 20140813
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/232 ; H01G4/12

Abstract:
In a multilayer capacitor, both a minimum distance in a thickness direction between a first effective portion of a first inner electrode and a second main surface and a minimum distance in the thickness direction between a second effective portion of a second inner electrode and the second main surface are shorter than any of a dimension in the thickness direction of a first extending portion of the first inner electrode, a dimension in the thickness direction of a second extending portion of the first inner electrode and a dimension in the thickness direction of the third extending portion of the second inner electrode.
Public/Granted literature
- US20160049253A1 MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR Public/Granted day:2016-02-18
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