Invention Grant
- Patent Title: Method for packaging flexible device using holding wafer, and flexible device manufactured by the same
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Application No.: US14478279Application Date: 2014-09-05
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Publication No.: US10172241B2Publication Date: 2019-01-01
- Inventor: Kyung Wook Baek , Keon Jae Lee , Geon Tae Hwang , Hyeon Kyun Yoo , Do Hyun Kim , Yoo Sun Kim
- Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Daejeon
- Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2013-0110231 20130913; KR10-2013-0110232 20130913; KR10-2014-0094466 20140725
- Main IPC: H05K3/32
- IPC: H05K3/32 ; H05K1/03 ; H05K3/00 ; H01L23/00
Abstract:
Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.
Public/Granted literature
- US20150077949A1 METHOD FOR PACKAGING FLEXIBLE DEVICE USING HOLDING WAFER, AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME Public/Granted day:2015-03-19
Information query
