Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15569743Application Date: 2016-04-12
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Publication No.: US10176993B2Publication Date: 2019-01-08
- Inventor: Dariush Zadeh , Shinichi Tanabe , Noriyuki Watanabe
- Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Current Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Womble Bond Dickinson (US) LLP
- Priority: JP2015-092937 20150430
- International Application: PCT/JP2016/061790 WO 20160412
- International Announcement: WO2016/175024 WO 20161103
- Main IPC: H01L21/225
- IPC: H01L21/225 ; H01L21/28 ; H01L21/285 ; H01L21/3215 ; H01L29/08 ; H01L29/45 ; H01L29/778 ; H01L29/205 ; H01L29/20

Abstract:
A third semiconductor layer (105) including a third nitride semiconductor is provided between an electrode (110) and a second semiconductor layer (104) including a second nitride semiconductor. The band gap of the second nitride semiconductor is set such that the carrier movement between a first semiconductor layer (103) and the third semiconductor layer (105) via the second semiconductor layer (104) is rate-determined by a diffusion process. The thickness of the second semiconductor layer (104) is set such that the carrier movement between the first semiconductor layer (103) and the third semiconductor layer (105) via the second semiconductor layer (104) is rate-determined by the diffusion process. The carrier movement between the first semiconductor layer (103) and the third semiconductor layer (105) via the second semiconductor layer (104) is rate-determined by a field emission process.
Public/Granted literature
- US20180130661A1 Semiconductor Device and Method of Manufacturing the Same Public/Granted day:2018-05-10
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