The present disclosure relates to semiconductor manufacturing and the teachings of the present disclosure may be embodied in a semiconductor chip with an interconnect monitor. Some embodiments may include arrays of diodes on the semiconductor chip; each diode with a stack of vertical interconnects and metal contacts, the stack and the diode connected in series and control mechanisms for addressing the diodes. The control mechanisms may include first inverters for applying either a high or a low voltage to columns of the diode stacks, connected at one end of each diode stack. Each first inverter may include reverse logic receiving a reverse logic signal and configured to invert a logic signal fed to the device for applying a relatively high or low voltage and second inverters for applying either a high or a low voltage to rows of the diode stack in the one of the plurality of arrays, connected at a second end of said diode stack, wherein each second inverter comprises reverse logic receiving an inverted reverse logic signal and configured to invert a logic signal fed to the device for applying a relatively high or low voltage.