Invention Grant
- Patent Title: Touch sensor assembly and method of manufacturing same
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Application No.: US14977605Application Date: 2015-12-21
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Publication No.: US10180748B2Publication Date: 2019-01-15
- Inventor: Hyunki Kim , Seungje Park
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2014-0189144 20141224
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H03K17/96 ; F25D29/00

Abstract:
A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.
Public/Granted literature
- US20160188093A1 TOUCH SENSOR ASSEMBLY AND METHOD OF MANUFACTURING SAME Public/Granted day:2016-06-30
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