- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US15429498申请日: 2017-02-10
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公开(公告)号: US10192879B2公开(公告)日: 2019-01-29
- 发明人: Tamotsu Ogata
- 申请人: Renesas Electronics Corporation
- 申请人地址: JP Tokyo
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Shapiro, Gabor and Rosenberger, PLLC
- 优先权: JP2015-070245 20150330
- 主分类号: H01L27/11568
- IPC分类号: H01L27/11568 ; H01L29/51 ; H01L29/792 ; H01L29/423 ; H01L21/28 ; H01L21/02 ; H01L21/311 ; H01L29/66 ; G11C16/04 ; G11C16/10 ; G11C16/14 ; H01L29/08
摘要:
An improvement is achieved in the performance of a semiconductor device having a nonvolatile memory. A memory cell of the nonvolatile memory includes a control gate electrode formed over a semiconductor substrate via a first insulating film and a memory gate electrode formed over the semiconductor substrate via a second insulating film to be adjacent to the control gate electrode via the second insulating film. The second insulating film includes a third insulating film made of a silicon dioxide film, a fourth insulating film made of a silicon nitride film over the third insulating film, and a fifth insulating film over the fourth insulating film. The fifth insulating film includes a silicon oxynitride film. Between the memory gate electrode and the semiconductor substrate, respective end portions of the fourth and fifth insulating films are located closer to a side surface of the memory gate electrode than an end portion of a lower surface of the memory gate electrode. Between the memory gate electrode and the semiconductor substrate, in a region where the second insulating film is not formed, another silicon dioxide film is embedded.
公开/授权文献
- US20170154893A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2017-06-01
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