- 专利标题: Wiring board and connection structure
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申请号: US15336904申请日: 2016-10-28
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公开(公告)号: US10194531B2公开(公告)日: 2019-01-29
- 发明人: Shigemi Ohtsu
- 申请人: FUJI XEROX CO., LTD.
- 申请人地址: JP Minato-ku, Tokyo
- 专利权人: FUJI XEROX CO., LTD.
- 当前专利权人: FUJI XEROX CO., LTD.
- 当前专利权人地址: JP Minato-ku, Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2016-106005 20160527
- 主分类号: H02B1/00
- IPC分类号: H02B1/00 ; H05K1/14 ; H05K1/02 ; H05K1/11 ; H05K3/36 ; H05K3/24
摘要:
Provided is a wiring board including a substrate formed of an insulation material, and plural conductive patterns including plural electrodes arranged on a surface of the substrate along an end surface of the substrate, and plural wiring patterns connected to the plural electrodes, respectively, wherein the substrate includes a notch formed between electrode groups each of which includes a predetermined number of the electrodes.
公开/授权文献
- US20170347453A1 WIRING BOARD AND CONNECTION STRUCTURE 公开/授权日:2017-11-30
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