- 专利标题: Method for manufacturing a field-effect transistor
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申请号: US15376895申请日: 2016-12-13
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公开(公告)号: US10204799B2公开(公告)日: 2019-02-12
- 发明人: Minehide Kusayanagi , Naoyuki Ueda , Yuki Nakamura , Yukiko Abe , Shinji Matsumoto , Yuji Sone , Ryoichi Saotome , Sadanori Arae
- 申请人: Minehide Kusayanagi , Naoyuki Ueda , Yuki Nakamura , Yukiko Abe , Shinji Matsumoto , Yuji Sone , Ryoichi Saotome , Sadanori Arae
- 申请人地址: JP Tokyo
- 专利权人: RICOH COMPANY, LTD.
- 当前专利权人: RICOH COMPANY, LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Cooper & Dunham LLP
- 优先权: JP2015-244316 20151215; JP2016-224441 20161117
- 主分类号: H01L21/44
- IPC分类号: H01L21/44 ; H01L29/24 ; H01L29/45 ; H01L29/66 ; H01L21/477 ; H01L29/786
摘要:
A method for manufacturing a field-effect transistor includes forming an active layer of an oxide semiconductor, forming a conducting film to cover the active layer, patterning the conducting film through an etching process using an etchant to form a source electrode and a drain electrode, and performing, at least before the patterning the conducting film, a treatment on the active layer so that an etching rate of the active layer is less than an etching rate of the conducting film.
公开/授权文献
- US20170186626A1 METHOD FOR MANUFACTURING A FIELD-EFFECT TRANSISTOR 公开/授权日:2017-06-29
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